Advanced topics of current interest in electronics engineering, with particular emphasis on microelectronics. Topics are selected from current technical literature to stress and reflect important potential areas in the electronic field. These topics include multichip modules, electronic packaging, microwave packaging, modeling simulation and evaluation of high speed devices, wideband characterization of electronic materials and multilayer structures, time and frequency domain measurement techniques.
This course will support the electronics curriculum at the advanced graduate level, filling a tremendous gap in the current curriculum related to multichip modules, electronic packaging, and wideband electrical characterization of electronic materials and structures. These topics are important to electrical engineers and need to be studied. The graduate students within the Electrical Engineering Department in the electronics area should be exposed to the rapid developments in the field of Electronics engineering as they mature. The Advanced Topics course will be taught by a faculty member with the right field of expertise. This course gives the flexibility of teaching state-of-the-art subject matter in the electronics, and in particular the microelectronics area.
Prerequisites: Graduate standing
The material covered in the Advanced Topics course is of a nature which requires varied analytical and engineering skills which cannot be associated with any specific course. A general maturity of the enrolled graduate students in the course is expected.
Percentage of Course
|Modeling, simulation, and evaluation of high speed devices||10%|
|RF and wideband design and characterization of hybrid microelectronics||15%|
|Very high speed packaging||10%|
|Measurement techniques in time and frequency domains||20%|
|Wideband characterization of electronic materials and devices||20%|