The BRADLEY DEPARTMENT of ELECTRICAL and COMPUTER ENGINEERING

Undergraduate PROGRAMS

Course Information

Description

This two-course sequence covers principles and analyses for design and manufacture of electronic packages. 4235: design issues such as electrical, electromagnetic, thermal, mechanical, and thermomechanical, are covered at the lower levels of packaging hierarchy. Materials and process selection guidelines are discussed for the manufacturing and reliability of chip carriers, multichip and hybrid modules. 4236: system-level package design issues for meeting application requirements and modeling tools for analyzing electronic packages are introduced. Materials and process selection guidelines are discussed for the manufacturing and reliability of packaged electronic products.

Why take this course?

Demands for high performance and high integration of functions in electronic products have made the interconnection and protection of circuits critical to the overall system performance, reliability, and cost. A multidisciplinary electronic packaging team is necessary to develop a competitive product. The aim of this course is to better prepare students for the electronics industry by teaching them the principles of electronic packaging, such as how thermal, mechanical, electrical, and materials issues are taken into consideration for packaging a complex electronic system. This course also serves as an introduction to the subject for electrical and materials graduate students who have had no previous exposure to the subject.

Technical Elective

Prerequisites

C- or better in 2204 or 3054.

The course builds on the basics of chemistry and physics as covered in CHEM 1054 and PHYS 2306 as well as electronics and networks as covered in ECpE 2204 or ECpE 3254.

Major Measurable Learning Objectives

  • Design basic architecture and layout of an electronic package;
  • Calculate signal delays, wiring capability, power distribution/signal noise, temperature distribution, thermal stresses, and reliability of electronic packages;
  • Select appropriate materials and processes for the fabrication, interconnection, and assembly of chip carriers, multichip and hybrid modules.

Course Topics

Topic

Percentage of Course

Introduction to Microelectronics and Electronic Packaging 10%
Electrical and Electromagnetic Design Issues 15%
Thermal and Thermomechanical Design Issues 10%
Designs, Materials, and Processes for Ceramic Chip Carriers, Multichip and Hybrid Modules 15%
Designs, Materials, and Processes for Plastic Packages 15%
Printed-wiring Board (PWB) Designs, Materials and Processes 10%
Chip to Package Interconnections 10%
Package Reliability, Testing, and Failure analysis 15%