ECE: Electrical & Computer Engineering
Accredited by ABET
Undergraduate Programs

ECE 4234 Semiconductor Processing


Fall 2014 textbook list

The Fall 2014 ECE textbook list is available online for students.

Current Prerequisites & Course Offering

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ECE 4234 Semiconductor Processing (3C)

Manufacturing practices used in silicon integrated circuit fabrication and the underlying scientific basis for these process technologies. Physical models are developed to explain basic fabrication steps, such as substrate growth, thermal oxidation, dopant diffusion, ion implantation, thin film deposition, etching, and lithography. The overall CMOS integrated circuit process flow is described within the context of these physical models.

What is the reason for this course?

The key to realizing the theoretical limits of electronic device and circuit performance is the ability to integrate many dissimilar materials over extremely small length scales into complex three-dimensional patterns. The aim of this course is to better prepare students for advanced work in microelectronics by teaching them the basic physical underpinnings of this integration in semiconductor processing.

Technical Elective. Typically offered: Fall, Spring. Program Area: Electronics.

Prerequisites: 2204 or 3054.

Why are these prerequisites or corequisites required?

The course builds on the phenomenological description of silicon integrated circuit processing and the laboratory experience taught in ECE 2224 (cross-listed as MSE 2224). Also, it requires some basic understanding of semiconductor device physics as taught in ECE 2204 or ECE 3054.

Department Syllabus Information:

Major Measurable Learning Objectives:
  • Analyze the basic physical principles underlying the key semiconductor processing steps.
  • Analyze the manufacturing methods and equipment used throughout the integrated circuit fabrication process.
  • Evaluate the mechanical, chemical, optical and electrical measurements used to characterize the semiconductor wafer at crucial stages in the fabrication process.
  • Apply computer simulation in process development.
  • Calculate design parameters for individual process steps.
  • Explain the entire CMOS integrated circuit process flow including choices of materials and processing conditions.
  • Design an overall CMOS process to meet particular device objectives.
  • Students will master items (1) through (5) above for topics 1 through 9 of the syllabus, and items (6) and (7) above with respect to topic 10 of the syllabus.

Course Topics
Topic Percentage
Crystal Growth and Wafer Fabrication 10
Clean Rooms - Contamination Control 10
Lithography 10
Thermal Oxidation 10
Dopant Diffusion 10
Ion Implantation 10
Thin Film Depostion 10
Etching 10
Back End Technology 10
CMOS Process Flow 10

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