12:00 AM - 7:30 PM on Monday, February 18, 2013
Location: 330 Lavery Hall
Intel's Dr. Joseph Steigerwald will give a presentation on leading edge silicon technology development.
Joe Steigerwald is an Intel Fellow and director of Chemical Mechanical Polish Technology, Intel Technology and Manufacturing Group. He is responsible for pathfinding, development, and transfer to high volume manufacturing of advanced chemical mechanical polish (CMP) and metals deposition modules for Intel's 14nm, 10nm, and 7nm logic and advanced memory technologies.
Bring your resume. Dinner will be served.