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2004 Annual Report


Head Letter

Chair Letter

Features
Campus Tansformation

Beyond Imaging

Photonic Biomedicine

Cell Behavior

No-Kill Sensors

Laser Scanning

Hokie Suit

Software Design

 
ECE Research Update

Research News
 

Cognitive Radio

Network Game Theory

Hardware Middleware

UWB Lab

High-Temp Sensor

Cell phone detector

Optical Cryptography

Shoot-Through Failures

IPEMs

Die-Attach

R&D 100 Award

Electronic Noses

Distributed Generation

USG

$1000 Elevator

Embedded Systems

Defect Tolerance

Efficiency Tools

Pervasive Networks

Video Networks

Networked Testbeds

Real-Time Solutions

2002/2003 Ph.D.s

2003 Patents

 

 

 

Special Report:
ECEs and Biomedicine

April 2004

 

For more information, visit the CPES web site.

Die-attach technology for high-temp packaging

Using nanoscale metal pastes, CPES researchers are developing an environmentally friendly die-attach technology that could allow wide band gap power semiconductor devices to function at high temperatures.

The use of wide-band gap devices, such as SiC or GaN diodes and transistors, offers superior switching characteristics and the ability to function at temperatures up to 350° C, which would reduce heat sink and cooling requirements in electronic equipment.

Current attachment methods have too low of a melting point and/or pose environmental risks. CPES efforts are based on synthesis and processing of nanoscale metal pastes that can be sintered at low temperatures to reliably join semiconductor devices with packaging materials. Successful development would improve the performance, reliability, and cost-effectiveness of power electronics systems.

 
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http://www.ece.vt.edu/news/ar04/dieattach.html
Last updated: Wed, Jun 9, 2004