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Integrated Power Electronics Modules
CPES researchers advocate the vision of an integrated system approach via standardized building blocks, referred to as Integrated Power Electronics Modules (IPEMs). In this regard, CPES is promoting the idea of replacing the conventional wirebond with direct bonding, and has introduced a number of techniques, such as the flip-chip-on-flex and the embedded power technology.
In 2002, industry followed suit and came out with a range of products that eliminate wirebond, including Fairchild’s bottomless and BGA packaging, Hitachi’s lead-free packaging (LFPAK), International Rectifier’s FlipFet and DirectFET, Siliconix’s PowerPAK, and STMicroelectronics FLAT package.
In addition, CPES has developed technology for integrating electromagnetic power passives. This passive IPEM includes four capacitors, two inductors and one power transformer. Functional and process integration with improved thermal management were successfully demonstrated for the first time. This is precisely the concept CPES has been promoting for the past four and half years.
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