ECE: Electrical & Computer Engineering

ECE 6204 Advanced Topics in Electronics


Spring 2014 textbook list

The Spring 2014 ECE textbook list is available online for students.

Current Prerequisites & Course Offering

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ECE 6204 Advanced Topics in Electronics (3C)

Advanced topics of current interest in electronics engineering, with particular emphasis on microelectronics. Topics are selected from current technical literature to stress and reflect important potential areas in the electronic field. These topics include multichip modules, electronic packaging, microwave packaging, modeling simulation and evaluation of high speed devices, wideband characterization of electronic materials and multilayer structures, time and frequency domain measurement techniques.

What is the reason for this course?

This course will support the electronics curriculum at the advanced graduate level, filling a tremendous gap in the current curriculum related to multichip modules, electronic packaging, and wideband electrical characterization of electronic materials and structures. These topics are important to electrical engineers and need to be studied. The graduate students within the Electrical Engineering Department in the electronics area should be exposed to the rapid developments in the field of Electronics engineering as they mature. The Advanced Topics course will be taught by a faculty member with the right field of expertise. This course gives the flexibility of teaching state-of-the-art subject matter in the electronics, and in particular the microelectronics area.

Typically offered: Fall. Program Area: Electronics.

Prerequisites: Prerequisites: Graduate standing.

Why are these prerequisites or corequisites required?

The material covered in the Advanced Topics course is of a nature which requires varied analytical and engineering skills which cannot be associated with any specific course. A general maturity of the enrolled graduate students in the course is expected.

Department Syllabus Information:

Major Measurable Learning Objectives:
  • Design, analyze and process multichip modules (types C and L);
  • Design, and simulate the electrical performance of electronic packages, especially at microwave frequencies;
  • Conduct precision measurements to characterize electronic packages and structures;
  • Predict reliability and yield related to MCMs, interconnects, and electronic packaging.

Course Topics
Topic Percentage
Modeling, simulation, and evaluation of high speed devices 10%
RF and wideband design and characterization of hybrid microelectronics 15%
Electronic packaging 5%
Very high speed packaging 10%
Measurement techniques in time and frequency domains 20%
Multichip modules 20%
Wideband characterization of electronic materials and devices 20%

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