ECE: Electrical & Computer Engineering

ECE 5236G Advanced Principles of Electronic Packaging


Spring 2014 textbook list

The Spring 2014 ECE textbook list is available online for students.

Current Prerequisites & Course Offering

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ECE 5236G Advanced Principles of Electronic Packaging (3C)

System-level package design issues to meet application requirements are introduced and modeling tools for analyzing electronic packages are applied. Materials and process selection guidelines are discussed for the manufacturing and reliability of packaged electronic products. Application of theoretical principles to analysis designs.

Program Area: Electronics.

Prerequisites: Graduate standing.

Why are these prerequisites or corequisites required?

Graduate standing.

Department Syllabus Information:

Major Measurable Learning Objectives:
  • Design architecture and layout of an electronic package to application requirements;
  • Use a finite-element modeling tool to analyze the mechanical, or thermal, or thermomechanical, or electromagnetic designs of an electronic package;
  • Select appropriate materials and processes for the manufacture of an electronic package.
  • Apply theoretical principles in electrical and electromechanical engineering to analyze package designs.

Course Topics
Topic Percentage
1. Application Requirements of Packaged Electronic Systems 15%
2. System Partitioning and Package Architecture 20%
3. Mechanical and Environmental Analyses 15%
4. Thermal and Thermomechanical Analyses 20%
5. Electrical and Electromagnetic Analyses 20%
6. Evaluation of Alternative Designs and Processes 10%

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