ECE: Electrical & Computer Engineering

ECE 5235G Advanced Principles of Electronic Packaging


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ECE 5235G Advanced Principles of Electronic Packaging (3C)

Design issues such as electrical, electromagnetic, thermal, mechanical, and thermomechanical, are covered at the lower levels of packaging hierarchy. Materials and process selection guidelines are discussed for the manufacturing and reliability of chip carriers, multichip and hybrid modules. Theoretical bases for design methodology and package reliability. Solid modeling for electrical and thermal designs from chip to board.

What is the reason for this course?

Demands for high performance and high integration of functions in electronic products have made the interconnection and protection of circuits critical to the overall system performance, reliability, and cost. The aim of this course is to better prepare graduate students for research and development packaging efforts by teaching them the principles of electronic packaging, such as how thermal, mechanical, electrical, and materials issues are taken into consideration for packaging a complex electronic system.

Program Area: Electronics.

Prerequisites: Graduate standing.

Why are these prerequisites or corequisites required?

Graduate standing.

Department Syllabus Information:

Major Measurable Learning Objectives:
  • Design basic architecture and layout of an electronic package;
  • Calculate signal delays, wiring capability, power distribution/signal noise, temperature distribution, thermal stresses, and reliability of electronic packages;
  • Select appropriate materials and processes for the fabrication, interconnection, and assembly of chip carriers, multichip and hybrid modules.
  • Demonstrate an understanding of the theoretical principles used in electrical and electromechanical design of packages and how they impact the package reliability.
  • Model electrical and thermal designs from chip to board.

Course Topics
Topic Percentage
1. Introduction to Microelectronics and Electronic Packaging 10%
2. Electrical and Electromagnetic Theory and Design 15%
3. Thermal and Thermomechanical Theory and Design 10%
4. Designs, Materials, and processes for Ceramic Chip Carriers, Multichip and Hybrid Modules 15%
5. Designs, Materials, and Processes for Plastic Packages 15%
6. Printed-wiring Board (PWB) Designs, Materials and Processes 10%
7. Chip to Package Interconnections 10%
8. Package Reliability, Testing, and Failure analysis 10%
9. Solid Modeling and Simulation of Package Designs 5%

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