Spring 2013 textbook list
The Spring 2013 ECE textbook list is available online for students.
Current Prerequisites & Course Offering
For current prerequisites for a particular course, and to view course offerings for a particular semester, see the Virginia Tech Course Timetables.
ECE 5235G Advanced Principles of Electronic Packaging (3C)
Design issues such as electrical, electromagnetic, thermal, mechanical, and thermomechanical, are covered at the lower levels of packaging hierarchy. Materials and process selection guidelines are discussed for the manufacturing and reliability of chip carriers, multichip and hybrid modules. Theoretical bases for design methodology and package reliability. Solid modeling for electrical and thermal designs from chip to board.
Demands for high performance and high integration of functions in electronic products have made the interconnection and protection of circuits critical to the overall system performance, reliability, and cost. The aim of this course is to better prepare graduate students for research and development packaging efforts by teaching them the principles of electronic packaging, such as how thermal, mechanical, electrical, and materials issues are taken into consideration for packaging a complex electronic system.
Program Area: Electronics.
Prerequisites: Graduate standing.
Department Syllabus Information:Major Measurable Learning Objectives:
- Design basic architecture and layout of an electronic package;
- Calculate signal delays, wiring capability, power distribution/signal noise, temperature distribution, thermal stresses, and reliability of electronic packages;
- Select appropriate materials and processes for the fabrication, interconnection, and assembly of chip carriers, multichip and hybrid modules.
- Demonstrate an understanding of the theoretical principles used in electrical and electromechanical design of packages and how they impact the package reliability.
- Model electrical and thermal designs from chip to board.
|1. Introduction to Microelectronics and Electronic Packaging||10%|
|2. Electrical and Electromagnetic Theory and Design||15%|
|3. Thermal and Thermomechanical Theory and Design||10%|
|4. Designs, Materials, and processes for Ceramic Chip Carriers, Multichip and Hybrid Modules||15%|
|5. Designs, Materials, and Processes for Plastic Packages||15%|
|6. Printed-wiring Board (PWB) Designs, Materials and Processes||10%|
|7. Chip to Package Interconnections||10%|
|8. Package Reliability, Testing, and Failure analysis||10%|
|9. Solid Modeling and Simulation of Package Designs||5%|