This list of graduate courses is current as of July 7, 2008. Please check the Virginia Tech Timetables and the Banner system for up-to-date prerequisite information.

5004: NETWORK ANALYSIS

Modeling and analysis of networks using t-domain and s-domain techniques. Linear graph theory, network equations, state-space models and solutions. Multiports, scattering parameters, frequency and time domain representation of network functions and sensitivity measures. Pre: 3604. (3H,3C).

5200: Semiconductor Alloys and Heterostructures

Advanced treatment of semiconductor materials with an emphasis on binary compounds, ternary and quaternary alloys, and strained-layer structures. Topics include crystal structure; lattice vibrations and phonons; energy band structure; equilibrium and non-equilibrium carrier distributions; electron and hole transport via diffusion and drift; and carrier generation and recombination mechanisms. Pre: ECE 3204 or PHYS 3455 or MSE 3255. (3H, 3C).

5204: POWER SEMICONDUCTOR DEVICES

Characteristics, fabrication and application of power semiconductor devices which includes BJT, FET, power diodes, insulated gate and static induction transistors. Device drive requirements and power circuit interaction. Pre: 3204. (3H,3C) II.

5205-5206: BASIC SEMICONDUCTOR DEVICES

Description of the performance characteristics and limitations of basic semiconductor electronic devices in terms of the properties of semiconductor materials and device structure. (3H,3C) I,II.

5210: Microelectromechanical Systems From Fabrication to Application

is course focuses on the design, fabrication, and application of microsystems providing a unique opportunity for interdisciplinary interactions. (3H,3C) Pre: 4234 or BCHM 4124 or CHE 4114 or CHEM 4124 or ESM 4014 or ESM 4024 or ME 4304 or ME 4404 or MSE 4254 or MSE 4354. Graduate Standing. Typically offered during Spring.

5214: PHASE-LOCKED LOOPS: THEORY & PRACTICE

Fundamental theory and design concepts of frequency synchronization techniques. Emphasis is on phase-locked loops and applications in communications for frequency synthesis, tracking, and demodulation. Laboratory investigates fundamental principles of operation with a final project to devleop specific aspects of a loop in detail. Pre: 4405. (2H,3L,3C). Alternate year course.

5220: RADIO FREQUENCY INTEGRATED CIRCUIT (RFIC) TECHNOLOGY & DESIGN

Integrated circuit (IC) implementation of RF circuits for wireless communications applications. Transceiver architectures for cuurent wireless communications standards; active/passive device technologies for RFIC implementations; low noise amplifiers; mixers; frequency sources; power amplifiers; single-chip radios; and RFIC packaging and testing. Case studies of modern RFIC chip sets for current wireless communciations standards are examined. The course involves circuit design at the IC level; modern RF/microwave CAD software will be used in conjunction with the course. Design of a wireless transceiver functional block component RFIC chip. Pre: 3204, 3614, and either 4605 or 4104. (3H,3C). II, alternate years. Web site spring 2005.

5224: NON-LINEAR COMMUNICATION CIRCUITS

Advanced methods of analysis and design of communication circuits with emphasis on nonlinear effects and filtering. Nonlinear device models and their use in the design of oscillators and mixers at HF through UHF frequencies. The design of power amplifiers. Pre: 4605. (3H,3C) I. Alternate years, fall.

5234: EMI & NOISE REDUCTION TECHNIQUES

Theory and practice of E.M. noise coupling; Techniques for noise reduction: shielding, grounding and filtering. Measurement of EMI to comply with government regulation. EMI problems and solutions to switching power supply applications. Design of EMI filter. Pre: 4224 or 4205. (3H,3C) I.

5244: Advanced Power Conversion Techniques

High-frequency resonant, quasi-resonant, and multi-resonant power conversion techniques; zero-voltage and zero-current switching techniques in pulse-width modulation converters and inverters. Pulse-width modulation and frequency modulation; non-linear analysis techniques for resonant and soft-switching converters and inverters. Power factor correction recitifiers and distributed power systems. Pre: 4224. (3H,3C) I. Alternate years.

5254: POWER CONVERTER MODELING & CONTROL

Nonlinear modeling of power conversion circuit using discrete and average techniques analysis and design of voltage mode and current mode control; parallel module operation and system interactions; distributed power systems; time domain simulation and frequency domain measurement techniques. Pre: 4224. (3H,3C) II.

ECE 5260: POWER ELECTRONICS SYSTEM INTEGRATION

A broad overview of advanced power electronics technololgies with an emphasis on multi-disciplinary aspects of integrated design. Investigation of relationships between system application requirements and technological challenges in circuit topologies, power semiconductor devices, sensing and control, integrated packaging, and thermal management, and their impact on the system reliability and cost. Introduction to the concept of integrated power electronics modules and their application in distributed power systems and motor drives. The course is organized as a series of seminar lectures jointly taught by leading researchers from several universities and industry, via distance access. P/F only. Pre: 4224. (1H, 1C)

ECE 5274: MODELING AND CONTROL OF THREE-PHASE PWM CONVERTERS

Power conversion principles for three-phase pulse-width modulation techniques, control and converters. Development of averaged models of three-phase rectifiers and inverters in stationary and rotating coordinates. Small-signal models in rotating coordinates and control design. Introduction of switching state vectors and different modulation schemes. Three-phase inverter and rectifier applications. Parallel and multi-level three-phase converters. Pre: 4224 or equivalent. (3H, 3C) alternate years.

6204: ADVANCED TOPICS IN ELECTRONICS

Advanced topics of current interest in electronics engineering, with particular emphasis on microelectronics. Topics are selected from current technical literature to stress and reflect important potential areas in the electronic field. These topics include multichip modules, electronic packaging, microwave packaging, modeling simulation and evaluation of high speed devices, wideband characterization of electronic materials and multilayer structures, time and frequency domain measurement techniques. (3H,3C) II.

ECE 5984: Application and Design of High-density Multi-phase PWM Converters
F. Wang: T/R 9:30 a.m. - 10:45 p.m.

This course covers the design as well as key applications of the modern advanced high-density AC multi-phase PWM converters. The detailed state-of-the-art design methodology will be presented, including control, semiconductor device selection, loss calculation, thermal design, protection and auxiliary circuits, and converter system integration. The important interface issues with source and load will also be covered. The application topics will focus on PWM converters for electric machine drives, and will also discuss the converter application in electric power transmission and distribution network, as used in utility and autonomous power systems. (3C)

4205, 4206: ELECTRONIC CIRCUIT DESIGN

Stability and response of feedback amplifier, wideband amplifiers, operational amplifier characteristics, waveform generators and wave shaping, nonlinear circuit applications, signal generators, and photolithography. Design of analog electronic circuits, circuit simulation, response characterization, and printed-circuit construction. Pre: ECE 3204. (3H,3C) I,II.

4214: ELECTRONICS

Semiconductor devices and materials, Heterojunctions, light-emitting diodes, photodetectors, solar cells, Gunn devices, coupled charge devices, and thyristors. Pre: ECE 3204. (3H,3C) II.

4220: Analog Integrated Circuit Design

Integrated circuit design in silicon bipolar, MOS, and BiCMOS technologies for communications, sensor, instrumentation, data conversion, and power managment applications. Models for integrated circuit active devices in bipolar and MOS technologies; noise; current mirrors, active loads and references; amplifiers and output stages; operational amplifiers; and an introduction to data conversion circuits. Circuit design at the IC level; modern VLSI CAD software. Pre: 3204. (3H,3C) I.

4224: POWER ELECTRONICS

Power devices and switching circuits including inverters and converters; electronic power processing and control as applied to industrial drives, transportation systems, computers, and spacecraft systems. Pre: ECE 3204. (3H,3C) I.

4234: MICROELECTRONICS

Manufacturing practices used in silicon integrated circuit fabrication and the underlying scientific basis for these process technologies. Physical models are developed to explain basic fabrication steps, such as substrate growth, thermal oxidation, dopant diffusion, ion implantation, thin film deposition, etching, and lithography. The overall CMOS integrated circuit process flow is described within the context of these physical models. Pre: ECE 2204, ECE 2224, ECE 3054. (3H,3C) I.

4235-4236: Principles of Electronic Packaging

This two-course sequence covers principles and analyses for design and manufacture of electronic packages.

4235: design issues such as electrical, electromagnetic, thermal, mechanical, and thermomechanical, are covered at the lower levels of packaging hierarchy. Materials and process selection guidelines are discussed for the manufacturing and reliability of chip carriers, multichip and hybrid modules.

4236: system-level package design issues for meeting application requirements and modeling tools for analyzing electronic packages are introduced. Materials and process selection guidelines are discussed for the manufacturing and reliability of packaged electronic products. Pre: 2204; Co: 3054. (3H, 3C). I, II.

4284: POWER ELECTRONICS LABORATORY

Design and testing of electronic power processing systems for commercial and aerospace applications. Pre: ECE 4224. (3L,1C) II.